MSI PRO X870E-P WIFI Gaming Desktop Motherboard - AMD X870E Chipset - Socket AM5 - ATX
Quick tech specs
- Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Desktop Processors
- Ultra Performance: 14+2+1 Duet Rail Power System, dual 8-pin CPU power connectors, Core Boost, Memory Boost, 8-layer PCB made by 2oz thickened copper and server-grade level material
- Supports DDR5 Memory, Dual Channel DDR5 8200+ MT/s (OC)
- Frozr Guard: Extended Heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and EZ M.2 Shield Frozr II are built for high performance system and non-stop experience
Know your gear
The PRO Series is tailored to professionals from all walks of life. The lineup features impressive performance and high quality, while aiming to provide users incredible experience. Users who care about productivity and efficiency can definitely count on the MSI PRO Series to assist you with multitasking and increasing efficiency.
MSI motherboards are designed with advanced hardware and technology, well-supporting the demanding computing usage of gaming and AI. Moreover, we also introduce AI to MSI Center and BIOS, making everything more effortless than before.
14+2+1 DRPS POWER DESIGN
Unleash and sustain the maximum performance with a flagship VRM design built with a total of 14+2+1 digital power phases. Combining dual power connectors and 60A Smart Power Stage, PRO X870E-P WIFI is ready for the challenge of high-end processors.
Extended Heatsink
- Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads.
M.2 Shield Frozr
- Strengthened M.2 thermal solution helps keep M.2 SSD safe and ensures incredible performance.
Heavy Plated VRM Heatsink
- The VRM heatsink covers the upper MOS and helps dissipate the heat.
7W/mK Thermal Pad & Additional Choke Pad
- High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are runnging at high speed.
Enlarged Chipset Heatsink
- The enlarged heatsink is designed to reduce dust and noise and capable of maintaining high efficiency of heat dissipation.